No. | Partie # | Fabricant | Description | Fiche Technique |
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Formosa MS |
Chip Low VF Schottky Barrier Rectifier ......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................. |
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Formosa MS |
Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
(FM2xx-C) Chip Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. www.DataSheet4U.com 0.110(2.8) 0.094(2.4) Exceeds environmental standards of MIL-S-19 |
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Formosa MS |
(SFM2x-L) Chip Silicon Rectifier ● SMA-L 0.205(5.2) 0.189(4.8) Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low |
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Formosa MS |
Chip Schottky Barrier Rectifier ......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings and Electrical characteristics .............. |
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Formosa MS |
Silicon Rectifier Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Silicon Rectifier Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Glass passivated type Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Glass passivated type Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
|
|
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Formosa MS |
Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.067(1.7) 0. |
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Formosa MS |
(FM2xx-C) Chip Schottky Barrier Diodes Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. www.DataSheet4U.com 0.110(2.8) 0.094(2.4) Exceeds environmental standards of MIL-S-19 |
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Formosa MS |
(SFM2x-L) Chip Silicon Rectifier ● SMA-L 0.205(5.2) 0.189(4.8) Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low |
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Formosa MS |
(SFM2x-L) Chip Silicon Rectifier ● SMA-L 0.205(5.2) 0.189(4.8) Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low |
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Formosa MS |
SMD Schottky Barrier Rectifier ......................................................................................... 2 Mechanical data ...............................................................................2 Maximum ratings and Electrical characteristics .............. |
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Formosa MS |
SMD Schottky Barrier Rectifier ......................................................................................... 2 Mechanical data ...............................................................................2 Maximum ratings and Electrical characteristics .............. |
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Formosa MS |
SMD Schottky Barrier Rectifier ......................................................................................... 2 Mechanical data ...............................................................................2 Maximum ratings and Electrical characteristics .............. |
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