FEC Semiconductor 1SM fiche technique

No.	Partie #	Fabricant	Description
1	1SMA4740	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
2	1SMA110A	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
3	1SMA4761	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
4	1SMA4752	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
5	1SMA4748	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
6	1SMA4737	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
7	1SMA4733	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
8	1SMA4732	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
9	1SMA160A	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
10	1SMA120A	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
11	1SMA4764	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
12	1SMA4759	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
13	1SMA4758	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
14	1SMA4757	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
15	1SMA4756	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
16	1SMA4754	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
17	1SMA4753	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
18	1SMA4749	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
19	1SMA4743	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p
20	1SMA4739	FEC Semiconductor	SMD Zener Diode For surface mounted applications in order to optimize board space. Built-in strain relief. Glass passivated junction. Low inductance. Typical IR less than 5.0µA above 11V. High temperature soldering guaranteed: 260 /10 seconds at terminals. Plastic p