Eris SZ1 fiche technique

No.	Partie #	Fabricant	Description
1	SZ1240A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
2	SZ1300A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
3	SZ1330A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
4	SZ1250A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
5	SZ1270A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
6	SZ1220A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
7	SZ1180A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
8	SZ1200A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
9	SZ1150A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
10	SZ1160A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
11	SZ1120A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
12	SZ1130A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.
13	SZ1110A	Eris	Surface Mount Zener Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping with high power rating PrimaryCharacteristics VRRM VF TJ max 3.3~330V 1.