| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
|
|
|
Eris |
Surface Mount Glass Passivated Bridge Rectifier ‧Schottky Brrier Chip ‧Low Power Loss,High Efficiency ‧Ideally Suited for Automatic Assembly ‧Surge Overload Rating to 50A Peak ‧Plastic Case Material has UL Flammability Classification Rating 94V-0 Ordering Information Part No. MB22S THRU MB220S MB |
|
|
|
|
Eris |
Surface Mount Glass Passivated Bridge Rectifier ‧Schottky Brrier Chip ‧Low Power Loss,High Efficiency ‧Ideally Suited for Automatic Assembly ‧Surge Overload Rating to 50A Peak ‧Plastic Case Material has UL Flammability Classification Rating 94V-0 Ordering Information Part No. MB22S THRU MB220S MB |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Glass Passivated Bridge Rectifier ‧Schottky Brrier Chip ‧Low Power Loss,High Efficiency ‧Ideally Suited for Automatic Assembly ‧Surge Overload Rating to 50A Peak ‧Plastic Case Material has UL Flammability Classification Rating 94V-0 Ordering Information Part No. MB22S THRU MB220S MB |
|
|
|
|
NKK |
(MB2400 Series) Distinctive Characteristics 0942 • Fax (480) 998-1435 • www.nkkswitches.com 03-07 Snap-Action Pushbuttons Series MB2400 General Specifications www.DataSheet4U.com Electrical Capacity (Resistive Load) Power Level (code W): Logic Level (code G): Logic/Power Level (code A): |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|
|
|
|
Eris |
Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case |
|