No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ‧Glass passivated die construction ‧Low forward voltage drop ‧ High current capability ‧High surge current capability ‧Designed for surface mount application ‧Plastic material-UL flammability 94 PRIMARY CHARACTERISTICS IF VRRM IFSM VF TJ max 1.5 1 |
|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ‧Glass passivated die construction ‧Low forward voltage drop ‧ High current capability ‧High surge current capability ‧Designed for surface mount application ‧Plastic material-UL flammability 94 PRIMARY CHARACTERISTICS IF VRRM IFSM VF TJ max 1.5 1 |
|
|
|
Eris |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ‧Glass passivated die construction ‧Low forward voltage drop ‧ High current capability ‧High surge current capability ‧Designed for surface mount application ‧Plastic material-UL flammability 94 PRIMARY CHARACTERISTICS IF VRRM IFSM VF TJ max 1.5 1 |
|
|
|
Eris |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ‧Glass passivated die construction ‧Low forward voltage drop ‧ High current capability ‧High surge current capability ‧Designed for surface mount application ‧Plastic material-UL flammability 94 PRIMARY CHARACTERISTICS IF VRRM IFSM VF TJ max 1.5 1 |
|
|
|
Eris |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ‧Glass passivated die construction ‧Low forward voltage drop ‧ High current capability ‧High surge current capability ‧Designed for surface mount application ‧Plastic material-UL flammability 94 PRIMARY CHARACTERISTICS IF VRRM IFSM VF TJ max 1.5 1 |
|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
Glass Passivated Bridge Rectifier ‧Ideal for printed circuit board ‧Reliable low cost construction utilizing molded plastic technique results in inexpensive product ‧Lead tin plated copper Glass Passivated Bridge Rectifier Primary Characteristics IF 2 VRRM 50~1000 IFSM 50 VF |
|
|
|
Eris |
SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER ‧Glass passivated die construction ‧Low forward voltage drop ‧ High current capability ‧High surge current capability ‧Designed for surface mount application ‧Plastic material-UL flammability 94 PRIMARY CHARACTERISTICS IF VRRM IFSM VF TJ max 1.5 1 |
|