| No. | Partie # | Fabricant | Description | Fiche Technique |
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Texas Instruments |
Autonomous Audio Headset Switch 1 • Ground FET Switches (60mΩ typical) • Autonomous Detection of Headset Types: 3-Poles or 4-Poles (with MIC on SLEEVE or RING2) • Microphone Line Switches • Supports FM Signal Transmission Through the Ground FETs • Reduction of Click/Pop Noise • VDD |
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ETC |
ADJUSTABLE INFRAREDSENSOR SWITCH |
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ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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ETC |
Fast Recovery Epitaxial Diode q q q q q TVJ = 150°C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine I2t TVJ = 45°C t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine q q International standard package JEDEC TO-220 AC Planar passivated chips Very short recovery time Extremely |
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Texas Instruments |
3.5-mm Jack Detect and Headset Interface •1 Ultra Low-Power, High-Performance DirectPath™ Class-G Headphone Amplifier – Ground-Centered Output Eliminates DCBlocking Capacitors – 30 mW/Ch into 32 Ω / Ch at 1% THD+N – –42 dB to +6 dB Volume Control – 2.0 µV Output Noise at –42 dB Gain – 91-dB |
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ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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|
ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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|
ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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|
|
ETC |
SUBMINIATURE PC BOARD RELAY • • • • • • • Subminiature size for high density packaging DIL pitch terminals Epoxy sealed for automatic wave soldering High sensitivity: 150 mW nominal with 84 mW pickup Meets FCC Part 68.302 1500 V lightning surge Meets FCC Part 68.304 1000 V diel |
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Texas Instruments |
AUTONOMOUS AUDIO HEADSET SWITCH 1 • VDD Range = 2.7 V to 4.5 V • Break Before Make Stereo Jack Switches • Ron for Ground FET Switches – WCSP Package: 70 mΩ – QFN Package: 100 mΩ • Autonomous Detection of GND and MIC Connections • Detection Triggered by I2C or External Trigger Pin • |
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