| No. | Partie # | Fabricant | Description | Fiche Technique |
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Diotec |
High voltage Si-epitaxial planar transistors 55…+150°C MPSA94 400 V 400 V Characteristics (Tj = 25°C) Min. Collector-Base cutoff current – Kollektorreststrom IE = 0, - VCB = 200 V IE = 0, - VCB = 160 V Emitter-Base cutoff current – Emitterreststrom IB = 0, - VEB = 3 V Collector saturation volt |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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Diotec |
General Purpose Si-Epitaxial PlanarTransistors |
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Diotec |
High voltage Si-epitaxial planar transistors 55…+150°C MPSA94 400 V 400 V Characteristics (Tj = 25°C) Min. Collector-Base cutoff current – Kollektorreststrom IE = 0, - VCB = 200 V IE = 0, - VCB = 160 V Emitter-Base cutoff current – Emitterreststrom IB = 0, - VEB = 3 V Collector saturation volt |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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Diotec |
General Purpose Si-Epitaxial PlanarTransistors |
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Diotec |
High voltage Si-epitaxial transistors cutoff current – Kollektorreststrom IE = 0, VCB = 400 V MPSA44 Emitter-Base cutoff current – Emitterreststrom IB = 0, VEB = 4 V MPSA44 Collector saturation voltage – Kollektor-Sättigungsspannung 2) IC = 1 mA, IB = 0.1 mA IC = 10 mA, IB = 1 mA |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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DIOTEC |
4 Amps Silicon Bridge Rectifiers VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 200 AMPS PEAK |
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