| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
|
|
|
Diotec |
SMD Single Phase Bridge Rectifier UL recognized, File E175067 Slim Profile 2.5 mm Compliant to RoHS, REACH, Conflict Minerals 1) Mechanical Data 1) Taped and reeled Weight approx. Dimensions - Maße [mm] Case material Solder & assembly conditions IFAV VF Tjmax = 1.0 A < 1.1 V = 15 |
|
|
|
|
Diotec Semiconductor |
Silicon-Bridge Rectifiers ine 50 Hz Sinus-Halbwelle f > 15 Hz IFRM i2t 10 A 2) TA = 25°C 12.5 A2s TA = 25°C IFSM 50 A Operating junction temperature – Sperrschichttemperatur Storage temperature – Lagerungstemperatur Tj TS – 50...+150°C – 50...+150°C 1 2 ) Valid f |
|
|
|
|
DIOTEC |
5 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLO |
|
|
|
|
DIOTEC |
5 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLO |
|
|
|
|
DIOTEC |
5 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLO |
|
|
|
|
DIOTEC |
5 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLO |
|
|
|
|
DIOTEC |
5 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLO |
|
|
|
|
DIOTEC |
5 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLO |
|