| No. | Partie # | Fabricant | Description | Fiche Technique |
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ON Semiconductor |
3.3V ESD Protection Diodes • Low Capacitance (4 pF, I/O to GND) • Small Body Outline Dimensions ♦ 01005 Size: 0.445 x 0.240 mm • Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) • Low ESD Clamping Voltage • These Devices are Pb−Free, Halogen Free/BFR Free an |
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Diodes |
SCHOTTKY and Benefits Guard Ring Die Construction for Transient Protection Low Power Loss, High Efficiency Interlocking Clip Design for High Surge Current Capacity Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Dev |
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Diodes |
1.0A SURFACE MOUNT SCHOTTKY and Benefits Reduced ultra-low forward voltage drop (VF). Better efficiency and cooler operation. Reduced high temperature reverse leakage. Increased reliability against thermal runaway failure in high temperature operation Totally Lead-Free & |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE NEW PRODUCT · · · · Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Conductance H G A B D SOD-323 Dim A J Min 2.30 1.60 1.20 0.25 0.20 0.10 0° Max 2.70 1.80 1.40 0.35 0.40 0.15 8° Mechanic |
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Diodes |
SCHOTTKY BARRIER RECTIFER and Benefits Low forward voltage (VF) minimizes conduction losses and improves efficiency. Reduced high-temperature reverse leakage. Increased reliability against thermal runaway failure in high temperature operation. Totally Lead-Free & Fully |
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ON Semiconductor |
ESD Protection Diodes • Low Capacitance (5.5 pF Typ, I/O to GND) • Small Body Outline Dimensions: − 01005 Size: 0.435 x 0.230 mm • Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) • Low ESD Clamping Voltage • These Devices are Pb−Free, Halogen Free/BFR |
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Diodes |
SCHOTTKY and Benefits Guard Ring Die Construction for Transient Protection Low Power Loss, High Efficiency Interlocking Clip Design for High Surge Current Capacity Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Dev |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE NEW PRODUCT · · · · Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Conductance H G A B D SOD-323 Dim A J Min 2.30 1.60 1.20 0.25 0.20 0.10 0° Max 2.70 1.80 1.40 0.35 0.40 0.15 8° Mechanic |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE • Ultra-Small Surface Mount Package • Low Forward Voltage Drop • Fast Switching • PN Junction Guard Ring for Transient and ESD Protection • Lead Free/RoHS Compliant (Note 3) • Qualified to AEC-Q101 Standards for High Reliability • "Green" Device (Not |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE NEW PRODUCT · · · · Ultra-Small Surface Mount Package Low Forward Voltage Drop Fast Switching PN Junction Guard Ring for Transient and ESD Protection TOP VIEW A SOT-523 Dim A B B C Min 0.15 0.75 1.45 ¾ 0.90 1.50 0.00 0.60 0.10 0.10 0.45 0° Max |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER • Very Low Forward Voltage Drop • Guard Ring Construction for Transient Protection • High Conductance • Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 2, 4 and 5) SDM100K30L SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Mechanical |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE • Fast Switching Speed • Ultra-Small Surface Mount Package • For General Purpose Switching Applications • High Conductance • Lead Free/RoHS Compliant (Note 3) • "Green" Device (Note 4 and 5) SDM10M45SD SURFACE MOUNT SCHOTTKY BARRIER DIODE Mechanical |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE • Low Forward Voltage Drop • Guard Ring Construction for Transient Protection • Ideal for Low Logic Level Applications • Low Capacitance • Lead Free By Design/RoHS Compliant (Note 1) • Qualified to AEC-Q101 Standards for High Reliability • "Green" De |
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Diodes Incorporated |
SURFACE MOUNT SCHOTTKY BARRIER DIODE • Low Forward Voltage Drop • Guard Ring Die Construction for Transient Protection • Low Capacitance • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • Qualified to AEC-Q101 Standards for Hi |
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Diodes |
1A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE and Benefits 2 mm2 Footprint – 67% smaller than PowerDI123 Off Board Profile of 0.3mm – 70% thinner than PowerDI123 Low Forward Voltage Drop reduces Power Dissipation Soft switching characteristic ensures that EMI and EFI are minimised Guar |
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Diodes |
SCHOTTKY BARRIER RECTIFER and Benefits Low forward voltage (VF) minimizes conduction losses and improves efficiency. Reduced high temperature reverse leakage; Increased reliability against thermal runaway failure in high temperature operation. Totally Lead-Free & Fully |
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Diodes |
1.0A SURFACE MOUNT SCHOTTKY and Benefits Reduced ultra-low forward voltage drop (VF). Better efficiency and cooler operation. Reduced high temperature reverse leakage. Increased reliability against thermal runaway failure in high temperature operation Totally Lead-Free & |
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Diodes |
1.0A SURFACE MOUNT SCHOTTKY BRIDGE Low profile package, ideal for thin portable applications Low Forward Voltage Drop reduces power dissipation Soft switching characteristic ensures that EMI and EFI are minimised Guard Ring Die Construction for transient Protection Lead-Free |
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Diodes |
2-CHANNEL LOW CAPACITANCE ESD PROTECTION ARRAY Contact discharge per IEC61000-4-2 standard: ±12 kV (OUT Pins), ±4 kV(IN Pins) Withstands over 1000 ESD Strikes 1.5pF Typical Capacitance from OUT to VN Two channels of ESD Protection Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) |
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