DIODES US1 fiche technique

No.	Partie #	Fabricant	Description
1	US1NDFQ	DIODES	1.0A SURFACE-MOUNT ULTRA-FAST RECTIFIER and Benefits  Low-Profile, Small Form Factor Package  Low Leakage Current  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Low Forward Voltage, Low Power Loss  Lead-Free Finish & RoHS Compliant (Notes 1 & 2)  H
2	US1M	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Surge Overload Rating to 30A Peak  High Current Capability  Ideally Suited for Automated Assembly  Lead-Free Finish; RoHS Compliant (Note 1)  Halogen and Antimon
3	US1JF	AiT Components	ULTRAFAST RECOVERY RECTIFIER DIODES  For surface mounted applications  Low profile package  Glass Passivated Chip Junction  Easy to pick and place  High efficiency  Fast reverse recovery time  Available in SMAF Package MECHANICAL DATA Case: SMAF Terminals: Solderable per MIL-STD
4	US1AF	Kexin	Ultra Fast Recovery Diodes ● Glass Passivated Chip ● Low Forward Voltage Drop And High Current Capability ● Low Reverse Leakage Current ● Epoxy meets UL 94 V-0 flammability rating ● Ultra Fast Switching For High Efficiency 12 Top View PINNING PIN DESCRIPTION 1 Cathode 2 Anode
5	US1BF	Kexin	Ultra Fast Recovery Diodes ● Glass Passivated Chip ● Low Forward Voltage Drop And High Current Capability ● Low Reverse Leakage Current ● Epoxy meets UL 94 V-0 flammability rating ● Ultra Fast Switching For High Efficiency 12 Top View PINNING PIN DESCRIPTION 1 Cathode 2 Anode
6	US1DF	Kexin	Ultra Fast Recovery Diodes ● Glass Passivated Chip ● Low Forward Voltage Drop And High Current Capability ● Low Reverse Leakage Current ● Epoxy meets UL 94 V-0 flammability rating ● Ultra Fast Switching For High Efficiency 12 Top View PINNING PIN DESCRIPTION 1 Cathode 2 Anode
7	US1GF	Kexin	Ultra Fast Recovery Diodes ● Glass Passivated Chip ● Low Forward Voltage Drop And High Current Capability ● Low Reverse Leakage Current ● Epoxy meets UL 94 V-0 flammability rating ● Ultra Fast Switching For High Efficiency 12 Top View PINNING PIN DESCRIPTION 1 Cathode 2 Anode
8	US1JF	Kexin	Ultra Fast Recovery Diodes ● Glass Passivated Chip ● Low Forward Voltage Drop And High Current Capability ● Low Reverse Leakage Current ● Epoxy meets UL 94 V-0 flammability rating ● Ultra Fast Switching For High Efficiency 12 Top View PINNING PIN DESCRIPTION 1 Cathode 2 Anode
9	US1BF	AiT Components	ULTRAFAST RECOVERY RECTIFIER DIODES  For surface mounted applications  Low profile package  Glass Passivated Chip Junction  Easy to pick and place  High efficiency  Fast reverse recovery time  Available in SMAF Package MECHANICAL DATA Case: SMAF Terminals: Solderable per MIL-STD
10	US1DF	AiT Components	ULTRAFAST RECOVERY RECTIFIER DIODES  For surface mounted applications  Low profile package  Glass Passivated Chip Junction  Easy to pick and place  High efficiency  Fast reverse recovery time  Available in SMAF Package MECHANICAL DATA Case: SMAF Terminals: Solderable per MIL-STD
11	US1GF	AiT Components	ULTRAFAST RECOVERY RECTIFIER DIODES  For surface mounted applications  Low profile package  Glass Passivated Chip Junction  Easy to pick and place  High efficiency  Fast reverse recovery time  Available in SMAF Package MECHANICAL DATA Case: SMAF Terminals: Solderable per MIL-STD
12	US1MDFQ	Diodes	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER and Benefits  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Surge Overload Rating to 30A Peak  High Current Capability  Low Profile Design, Package Height Less than 1.1mm  Lead-Free Finish; RoHS Compliant (Not
13	US1JDFQ	Diodes	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER and Benefits  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Surge Overload Rating to 30A Peak  High Current Capability  Low Profile Design, Package Height Less than 1.1mm  Lead-Free Finish; RoHS Compliant (Not
14	US1NWF	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER and Benefits  Low Profile, Small Form Factor Package  Low Leakage Current  Glass Passivate Die Construction  Ultrafast Recovery Times for High Efficiency  Low Forward Voltage, Low Power Loss  Lead-Free Finish & RoHS Compliant (Notes 1 & 2)  Ha
15	US1GWF	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER and Benefits  Low Profile, Small Form Factor Package  Very Low Leakage Current  Glass Passivate Die Construction  Enhanced Ultrafast Recovery Times for High Efficiency  Low Forward Voltage, Low Power Loss  Lead-Free Finish & RoHS Compliant (Not
16	US1NWFQ	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER and Benefits  Low Profile, Small Form Factor Package  Low Leakage Current  Glass Passivated Die Construction  Ultra-Fast Recovery Times for High Efficiency  Low Forward Voltage, Low Power Loss  Lead-Free Finish & RoHS Compliant (Notes 1 & 2) 
17	US1D	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Surge Overload Rating to 30A Peak  High Current Capability  Ideally Suited for Automated Assembly  Lead-Free Finish; RoHS Compliant (Note 1)  Halogen and Antimon
18	US1B	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Surge Overload Rating to 30A Peak  High Current Capability  Ideally Suited for Automated Assembly  Lead-Free Finish; RoHS Compliant (Note 1)  Halogen and Antimon
19	US1A	DIODES	1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER  Glass Passivated Die Construction  Ultra-Fast Recovery Time for High Efficiency  Surge Overload Rating to 30A Peak  High Current Capability  Ideally Suited for Automated Assembly  Lead-Free Finish; RoHS Compliant (Note 1)  Halogen and Antimon
20	US1KF	AiT Components	ULTRAFAST RECOVERY RECTIFIER DIODES  For surface mounted applications  Low profile package  Glass Passivated Chip Junction  Easy to pick and place  High efficiency  Fast reverse recovery time  Available in SMAF Package MECHANICAL DATA Case: SMAF Terminals: Solderable per MIL-STD