| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
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|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
|
|
|
|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
|
|
|
|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
|
|
|
|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
|
|
|
|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
|
|
|
|
DEC |
SURFACE MOUNT FAST RECOVERY RECTIFIERS · Low profile space · Ideal for automated placement · Glass passivated chip junctions · Low forward voltage drop · Low leakage current · High forward surge capability · High temperature soldering : 260℃ / 10 seconds at terminals · Component in accord |
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