| No. | Partie # | Fabricant | Description | Fiche Technique |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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Dc Components |
(MMB2505 - MMB2510) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .480(12.2) .425(10.8) 1.181(30.0) 1.102( |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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Dc Components |
(MMB3505 - MMB3510) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .480(12.2) .425(10.8) 1.181(30.0) 1.102( |
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Dc Components |
(MMB3505 - MMB3510) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .480(12.2) .425(10.8) 1.181(30.0) 1.102( |
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Dc Components |
(MMB3505W - MMB3510W) RECTIFIER SPECIALISTS * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .591 MAX. (15.0) MMB-25W MECHANICAL DA |
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Dc Components |
(MMB3505W - MMB3510W) RECTIFIER SPECIALISTS * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .591 MAX. (15.0) MMB-25W MECHANICAL DA |
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Dc Components |
(MMB1505 - MMB1510) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 300 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .480(12.2) .425(10.8) 1.181(30.0) 1.102( |
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Dc Components |
(MMB1505W - MMB1510W) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 300 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .591 MAX. (15.0) MMB-25W MECHANICAL DA |
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Dc Components |
(MMB2505 - MMB2510) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .480(12.2) .425(10.8) 1.181(30.0) 1.102( |
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Dc Components |
(MMB2505W - MMB2510W) TECHNICAL SPECIFICATIONS OF SINGLE-PHASE SILICON BRIDGE RECTIFIER * Metal case for Maximum Heat Dissipation * Diffused Junction * High current capability * Surge overload ratings - 400 Amperes * Low forward voltage drop * High Reliability .500 (12.7) TYP. .310(7.9) .290(7.4) .591 MAX. (15.0) MMB-25W MECHANICAL DA |
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DC COMPONENTS |
SURFACE MOUNT SWITCHING DIODES * Low power loss, high efficiency * Low leakage * Low forward voltage drop * High speed switching * High current capability * High reliability MECHANICAL DATA * Case: Molded plastic * Epoxy: UL 94V-0 rate flame retardant * Terminals: Solder plated, s |
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DC COMPONENTS |
SURFACE MOUNT SWITCHING DIODES * Low power loss, high efficiency * Low leakage * Low forward voltage drop * High speed switching * High current capability * High reliability MECHANICAL DATA * Case: Molded plastic * Epoxy: UL 94V-0 rate flame retardant * Terminals: Solder plated, s |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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DC COMPONENTS |
SURFACE MOUNT SILICON ZENER DIODES * Planar Die construction * Zener Voltages from 2.4V - 39V * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MECHANICAL DATA * Case: Molded Plastic * Terminals:Solder plated, solderable per MIL-STD-202, Method 208 * Polarity |
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