Chilisin CS- fiche technique

No.	Partie #	Fabricant	Description
1	PBY321611T	Chilisin Electronics	SMD Multilayer Ferrite Chip Beads 00.20 1.60.20 0.50.3 453215 4.50.25 3.200.20 1.50.20 0.50.3 ：SB / PB / NB ：SB / PB / NB / HF ：SB / PB ：SB / PB / NB / GB / UPB / HF / VPB ：UPB ：SB ：SB / PB / NB / GB / UPB ：PB / UPB Dimension Conversion TYPE A B C 060303 0
2	PBY060303T	Chilisin Electronics	SMD Multilayer Ferrite Chip Beads 00.20 1.60.20 0.50.3 453215 4.50.25 3.200.20 1.50.20 0.50.3 ：SB / PB / NB ：SB / PB / NB / HF ：SB / PB ：SB / PB / NB / GB / UPB / HF / VPB ：UPB ：SB ：SB / PB / NB / GB / UPB ：PB / UPB Dimension Conversion TYPE A B C 060303 0
3	MHCD322512-2R2N-A8T	Chilisin Electronics	Molding Power Choke  Monolithic, magnetically shielded  Compact high saturation current  Minimum height=1.0mm Max Applications  Smartphone  Tablet PC  Hard disk of ultrabook  LTE module  Portable device Product Identification http://www.DataSheet4U.net/ Shap
4	HPY160808T-181Y-NP	Chilisin Electronics	SMD Multilayer Ferrite Chip Beads 00.20 1.60.20 0.50.3 453215 4.50.25 3.200.20 1.50.20 0.50.3 ：SB / PB / NB ：SB / PB / NB / HF ：SB / PB ：SB / PB / NB / GB / UPB / HF / VPB ：UPB ：SB ：SB / PB / NB / GB / UPB ：PB / UPB Dimension Conversion TYPE A B C 060303 0
5	BC1005IR-330-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
6	BC1506IR-330-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
7	NL201614	Chilisin Electronics	SMD Wire Wound Ferrite Chip Inductors  RoHS compliant  Strong solderability by reflow soldering and soldering iron  Highly accurate dimensions  Can be mounted automatically  Terminals are highly resistant to external forces  Highly resistant to mechanical shocks and pressure  High
8	CS-0603	Chilisin	SMD Ceramic Chip Inductors This type of Miniature SMD Ceramic Chip Inductor is specially designed for the needs of today’s high frequency related product. These products deliver very high SRF and also Excellent Q factor. With the non-magnetic coil form it’s assure utmost tem
9	CS1008	Chilisin Electronics	SMD Wire Wound Ceramic Chip Inductors  RoHS Compliant  Ceramic body and wire wound construction provide high SRFs  Exceptional Q values even at high frequencies  Highest possible SRFs as well as excellent Q values  The non-magnetic coil form assures utmost thermal stability, predict
10	LVF505020	Chilisin Electronics	Sealed Power Inductors  RoHS compliant  Low DC resistance and high current  Highly accurate dimensions  Superior EMI characteristics with ultra low radiation comparing to conventional shielded power inductors  Halogen free Applications  Smart phone  DSC  Tablet PC
11	BC1306IR-300-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
12	MHCD201610-1R0M-A8T	Chilisin Electronics	Molding Power Choke  Monolithic, magnetically shielded  Compact high saturation current  Minimum height=1.0mm Max Applications  Smartphone  Tablet PC  Hard disk of ultrabook  LTE module  Portable device Product Identification http://www.DataSheet4U.net/ Shap
13	AME201610T	Chilisin Electronics	SMD Alloy Molding Power Inductors  Monolithic, magnetically shielded  Compact sizing, high saturation current  Minimum height=1.0mm Max Product Identification Applications  Smartphone  Tablet PC  Hard Disk of ultrabook  LTE module  Portable device  Packaging : T：Tape and Re
14	LS1008	Chilisin Electronics	SMD Wire Wound Ferrite Chip Inductors  RoHS compliant  Very strong solderability by reflow soldering and soldering iron  Highly accurate dimensions  Can be mounted automatically  Terminals are highly resistant to external forces  Highly resistant to mechanical shocks and pressure 
15	BC1104IR-300-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
16	BC1305IR-330-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
17	BC2006IR-430-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
18	BC2310IR-960-N	Chilisin Electronics	Leaded Power Chokes l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils roar to an all-time low Applications l Compact size, high performance, low cost l With Large current loads l Toroidal shape core reduces coils
19	AL0510	Chilisin Electronics	Leaded RF Chokes l Design to be compact, small and light-weight l Wide range of inductance l Contribute to be high Q and self-resonant frequencies l Tapping type that is convenient for automatic insertion l Coating epoxy resin that ensure the humidity resistance to b
20	MHCD201610-1R5M-A8T	Chilisin Electronics	Molding Power Choke  Monolithic, magnetically shielded  Compact high saturation current  Minimum height=1.0mm Max Applications  Smartphone  Tablet PC  Hard disk of ultrabook  LTE module  Portable device Product Identification http://www.DataSheet4U.net/ Shap