| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
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|
CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
|
|
|
|
CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
|
|
|
|
CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
|
|
|
|
CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
|
|
|
|
CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
|
|
|
|
CITC |
Dual High-power Super Fast Rectifier Outline • Low profile surface mounted application in order to optimize board space. • High current capability, low forward voltage drop. • High surge capability. • Superfast recovery time for switching mode application. • Glass passivated chip junc |
|