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CITC B14 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
CB140WG-S

CITC
Trench Schottky Rectifier

• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Lead free in compliance with EU RoHS.
■ Outline SOD-123S 0.039(1.0) 0.031(0.8) 0.154(3.9) 0.138(3.5) 0.016(0.4) Typ. Marking code 0.079(2.0) 0.063
Datasheet
2
B140W-ST

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet
3
B140LW

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet
4
B140LW-ST

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet
5
B140LW-S

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet
6
B140WG-SL

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet
7
B140WS

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Tiny plastic SMD package.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal
Datasheet
8
B140W-S

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet
9
B140W

CITC
1A Surface Mount Schottky Barrier Rectifiers

• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
Datasheet



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