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CDIL KBU DataSheet

No. Partie # Fabricant Description Fiche Technique
1
KBU6005

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet
2
KBU601

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet
3
KBU602

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet
4
KBU604

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet
5
KBU606

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet
6
KBU608

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet
7
KBU610

CDIL
SINGLE PHASE SILICON BRIDGE RECTIFIER
NIT V V V A o IFSM VF IR *Rth (j-a) *Rth (j-L) TJ, Tstg 200 1.0 5.0 500 8.6 3.1 - 55 to +125 o o A V µA µA C/W C/W o C *Thermal resistance junction to Ambient with units in free air, PCB mounted on "0.5 x 0.5" (12 x 12mm) copper pads, 0.375"(9.
Datasheet



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