| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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APV |
Mimi Molded SMD Power Inductors |
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APV |
Mimi Molded SMD Power Inductors |
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APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
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APV |
Mimi Molded SMD Power Inductors |
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|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
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APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
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|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
|
|
|
|
APV |
Molded SMD Power Inductors ● Lowest molded height in this package Footprint. ● Shielded construction. ● Handles high transient current spikes without saturation. ● Ultra low buzz noise, due to composite construction. ● Encapsulated body offers improved environmental protection |
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