AMI SEMICONDUCTOR PI3 fiche technique

No.	Partie #	Fabricant	Description
1	PI331MC-DR	AMI SEMICONDUCTOR	300DPI CIS Two Level Digital Output Module • Light source, lens, and sensor are integrated into a single module • 11.8 dpm resolution, 89 mm scanning length • Up to 600 µsec/line scanning speed, with 2 MHz pixel rate (See Table 3, Note 3.) (Other speeds are also available) • Wide dynamic rang
2	PI3012A	AMI SEMICONDUCTOR	300DPI CIS Sensor Chip spacing is approximately 84.6 µm. The size of each chip without scribe lines is 8080 µm by 380 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1. PAGE 1 of 7 PI3012A6, 6/9/99 www.DataSheet4U.com SYMBOL
3	PI3033B	AMI SEMICONDUCTOR	Contact Image Sensor ip selector. The detector's elementto-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad symbols and function
4	PI3034A	AMI SEMICONDUCTOR	200DPI CIS Sensor Chip ultiplexing switches, buffers, and a chip selector. The detector element-to-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 290 um. Each sensor chip has 6 bonding pads. The pad symbols and functions a
5	PI3041A	AMI SEMICONDUCTOR	Contact Image Sensor 300DPI CIS Sensor Chip nners down to the narrow width scanners, such as, those found in check readers, lotto tickets, entrance gates tickets, etc. This is not to exclude the many office automation equipments, which require an even more variety in scanning widths, as well a
6	PI3039	AMI SEMICONDUCTOR	600DPI CIS Image Sensor Chip Each sensor chip consists of 192 detector elements, their associated multiplexing switches, buffer amplifiers, and a chip selector. The detector's elementto-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080
7	PI3042A	AMI SEMICONDUCTOR	Contact Image Sensor Chip ice automation equipment which requires a wide variety of scanning widths. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector elements, their associated multiplexing switches, buffers, and a chip selecto
8	PI330MC-DR	AMI SEMICONDUCTOR	300DPI CIS Two Level Digital Output Module • Light source, lens, and sensor are integrated into a single module • 11.8 dpm resolution, 89 mm scanning length • Up to 423 µsec/line scanning speed, with 2.5 MHz pixel rate (See Table 3, Note 3.) • Wide dynamic range • Two-Level Tracking Digital O