No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
|
|
Comchip Technology |
1500W Transient Voltage Suppressor -Glass passivated chip. -Low leakage. -1500W peak pulse power capability with a 10/1000μs waveform, repetitive rate (duty cycle): 0.01%. -Uni and Bidirectional unit. -Excellent clamping capability. -Very fast response time. Mechanical Data -Case: Mol |
|
|
|
Comchip Technology |
1500W Transient Voltage Suppressor -Glass passivated chip. -Low leakage. -1500W peak pulse power capability with a 10/1000μs waveform, repetitive rate (duty cycle): 0.01%. -Uni and Bidirectional unit. -Excellent clamping capability. -Very fast response time. Mechanical Data -Case: Mol |
|
|
|
Comchip Technology |
1500W Transient Voltage Suppressor -Glass passivated chip. -Low leakage. -1500W peak pulse power capability with a 10/1000μs waveform, repetitive rate (duty cycle): 0.01%. -Uni and Bidirectional unit. -Excellent clamping capability. -Very fast response time. Mechanical Data -Case: Mol |
|
|
|
Comchip Technology |
1500W Transient Voltage Suppressor -Glass passivated chip. -Low leakage. -1500W peak pulse power capability with a 10/1000μs waveform, repetitive rate (duty cycle): 0.01%. -Uni and Bidirectional unit. -Excellent clamping capability. -Very fast response time. Mechanical Data -Case: Mol |
|
|
|
Microsemi Corporation |
FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag – |
|
|
|
Microsemi Corporation |
FLIP CHIP TVS DIODES • Unidirectional and Bidirectional • Fully glass passivated • 1500 watt (10/1000 µs) • Eliminates wire bonding • No overshoot • NON Inductive Insertion MECHANICAL • Weight: 0.3 grams (approximate) • Cathode mark on top side • Metallization Cr - Ag – |
|