The new MTP module is easy to use thanks to solder less method for contacting PressFit pins to the PCB. The low profile package has been specifically conceived to maximize space saving and optimize the electrical layout of the application specific power supplies. MAJOR RATINGS AND CHARACTERISTICS SYMBOL CHARACTERISTICS VALUES 40MT IO IFSM TC 50 Hz 60 Hz.
• Low VF
• Low profile package
• Direct mounting to heatsink
• PressFit pins technology
• Low junction to case thermal resistance
• 3500 VRMS insulation voltage
• UL approved file E78996
• Designed and qualified for industrial level
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Power conversion machines
• Welding
• UPS
• SMPS
• Motor drives
• General purpose and heavy duty application
DESCRIPTION
The new MTP module is easy to use thanks to solder less method for contacting PressFit pins to the PCB. The low profile package has been s.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | VS-100MT160P |
Vishay |
Three Phase Bridge | |
2 | VS-100MT160P.PbF |
Vishay |
Three Phase Bridge | |
3 | VS-100MT1.0P.PbF |
Vishay |
Three Phase Bridge | |
4 | VS-100MT140P |
Vishay |
Three Phase Bridge | |
5 | VS-100MT060WDF |
Vishay |
Primary MTP IGBT | |
6 | VS-100M |
Fujitsu |
POWER RELAY | |
7 | VS-100BGQ015 |
Vishay |
Schottky Rectifier | |
8 | VS-100BGQ030 |
Vishay |
Schottky Rectifier | |
9 | VS-100BGQ045HF4 |
Vishay |
Schottky Rectifier | |
10 | VS-100BGQ100 |
Vishay |
Schottky Rectifier | |
11 | VS-100BGQ100HF4 |
Vishay |
High Performance Schottky Rectifier | |
12 | VS-100S |
Fujitsu |
POWER RELAY |