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Gold bumped die with MTP function General Notes APPLICATION INFORMATION For improved readability, the specification contains many application data points. When application information is given, it is advisory and does not form part of the specification for the device. USE OF I C The implementation of I C is already included and tested in all silicon. Howeve.
to support optimized COG applications. VDD (digital) range: 1.8V (Typ.) ~ 3.3V VDD (analog) range: 2.5V (Typ.) ~ 3.3V 4.8V ~ 11.8V LCD VOP range: MTP VLCD trimming circuit to support precise LCD contrast matching Available in gold bump dies: Bump pitch: 29 µM Bump gap: 13 µM 2 Bump surface: 2000 µM
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MAIN APPLICATIONS
• Cellular Phones and other battery operated palm top devices or portable Instruments
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FEATURE HIGHLIGHTS
• Single chip controller-driver for 68x98 matrix C-STN LCD with comprehensive support for input format and color depth: 8-bit RGB: 256-color 12-bit RGB: 4K-c.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | UC1681S |
ETC |
Single Chip Ultra Low Power Passive Color LCD Controller Driver |
|
| 2 | UC1682 |
Ultra Chip |
HIGH-VOLTAGE MIXED-SIGNAL IC |
|
| 3 | UC1602 |
Ultra Chip |
65COM x 102SEG Passive Matrix LCD Controller-Driver |
|
| 4 | UC1602I |
Ultra Chip |
65x102 Matrix LCD Controller-Driver |
|
| 5 | UC1606 |
Ultra Chip |
65COM x 132SEG Matrix LCD Controller-Driver |
|
| 6 | UC1608 |
Ultra Chip |
128COM x 240SEG Matrix LCD Controller-Driver |
|
| 7 | UC1610 |
Unitrode |
Dual Schottky Diode Bridge |
|
| 8 | UC1610 |
Texas Instruments |
DUAL SCHOTTKY DIODE BRIDGE |
|
| 9 | UC1611 |
Texas Instruments |
Quad Schottky Diode Array |
|
| 10 | UC1611s |
ULTRACHIP |
Matrix LCD Controller |
|
| 11 | UC1617 |
Ultra Chip |
Ultra-Low Power 128COM x 128SEG Matrix Passive LCD Controller-Driver |
|
| 12 | UC1617S |
Ultra Chip |
128 X 128 STN Controller Driver |
|