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TSF-6522 - ETC

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TSF-6522 No-Clean Tacky Soldering Flux

Kester formula TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. The TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a www.DataSheet4U.com rework application for surface mount packages. TSF-6522 maintains its activity and dispensing characteristics for up to 8 h.

Features

Halide Tests:
• Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33
• Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
• Typical S.I.R., IPC: Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3, (B-24 coupon) 10 Blank at 24 hours: 3.08 x 10 ohms Blank at 96 hours: 1.27 x 1010 ohms Blank at 168 hours: 8.79 x 109 ohms Physical Properties (typical)
• Viscosity: 285 poise Kester Method #1W-QC-3-09 Uncleaned at 24 hours: 2.56 x 108 ohms Uncleaned at 96 hours: 4.17 x 108 ohms Uncleaned at 168 hours: 6.38 x 108 ohms
• Typical S.I.R., Bellcore: Tested to .

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