TIBPAL16R6-5C - Texas Instruments

TIBPAL16R6-5C HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS

TIBPAL16L8’ C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J PACKAGE (TOP VIEW) I1 I2 I3 I4 I5 I6 I7 I8 I9 GND 10 20 VCC 19 O 18 I/O 17 I/O 16 I/O 15 I/O 14 I/O 13 I/O 12 O 11 I TIBPAL16L8’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I I VCC O I 3 2 1 20 19 4 18 I/O I5 17 I/O I6 16 I/O I7 15 I/O I8 14 I/O 9 10 11 12 13 .

Features

Output Pins Go High)
• Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
• Security Fuse Prevents Duplication DEVICE I 3-STATE INPUTS O OUTPUTS ’PAL16L8 10 2 ’PAL16R4 8 0 ’PAL16R6 8 0 ’PAL16R8 8 0 REGISTERED Q OUTPUTS 0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers) I/O PORT S 6 4 2 0 description TIBPAL16L8’ C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J PACKAGE (TOP VIEW) I1 I2 I3 I4 I5 I6 I7 I8 I9 GND 10 20 VCC 19 O 18 I/O 17 I/O 16 I/O 15 I/O 14 I/O 13 I/O 12 O 11 I TIBPAL16L8’ C SUFFIX . . . FN PACKAGE.