TC358774XBG - Toshiba

TC358774XBG Mobile Peripheral

TC358774XBG/TC358775XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358774XBG/TC358775XBG Mobile Peripheral Devices Overview TC358774XBG The TC358774XBG/TC358775XBG Functional Specification defines operation of the DSISM to LVDS low power chip (or more abbreviated, TC358775XBG chip). TC358775XBG is the follow-up chip of TC358764XBG/ TC358765X.

Features

● DSI Receiver  Configurable 1- up to 4-Data-Lane DSI Link with bi-directional support on Data Lane 0  Maximum bit rate of 1 Gbps/lane  Video input data formats: - RGB565 16-bits per pixel - RGB666 18-bits per pixel - RGB666 loosely packed 24-bits per pixel - RGB888 24-bits per pixel  Video frame size: - Up to 1600×1200 24-bits per pixel resolution to single-link LVDS display panel, limited by 135 MHz LVDS speed - Up to WUXGA resolutions (1920×1200 24-bits pixels) to dual-link LVDS display panel, limited by 4 Gbps DSI link speed  Supports Video Stream packets for video data transmission. .