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TA31142FNG - Toshiba Semiconductor

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TA31142FNG FM IF DETECTION IC

TA31142FNG TA31142FG/FNG TA31142FG,TA31142FNG TA31142FNG TA31142FG www.DataSheet4U.com TA31142FNG 2005-04-07 2006-12-20 TA31142FG/FNG TA31142FNG www.DataSheet4U.com 2005-04-07 2005-04-07 2006-12-20 TA31142FG/FNG TA31142FNG www.DataSheet4U.com 2005-04-07 2006-12-20 TA31142FG/FNG TA31142FNG www.DataSheet4U.com 2005-04-07 2006-12-20 TA31142FG/FNG.

Features

Use of Sn-37Pb solder Bath solder bath temperature = 230 dipping time = 5seconds the number of times = once use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath solder bath temperature = 245 dipping time = 5seconds www.DataSheet4U.com the number of times = once use of R-type flux RESTRICTIONS ON PRODUCT USE x The information contained herein is subject to change without notice. x The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other righ.

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