SOT353 - NXP

SOT353 plastic surface-mounted package

, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT353 plastic surface-mounted package; 5 leads SOT353 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 NXP.

Features

v w y mm 1.1 0.8 0.1 0.3 0.25 0.2 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 0.45 0.25 2.0 0.15 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 IEC REFERENCES JEDEC JEITA SC-88A Fig. 1. Package outline TSSOP5 (SOT353) EUROPEAN PROJECTION ISSUE DATE 04-11-16 06-03-16 SOT353 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 NXP Semiconductors SOT353 plastic surface-mounted package; 5 leads 3. Soldering 2.65 0.75 2.35 0.75 0.5 0.6 (4×) (4×) 0.4 0.5 (4×) 0.6 (4×).