Recherchez avec le numéro de pièce ainsi que le fabricant ou la description
PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 D seating plane ME A2 A L A1 c Z e b1 b 14 8 MH w M (e 1) pin 1 index E 1 7 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. .
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| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | SOT23 |
TT Electronics |
Surface Mount Voltage Divider |
|
| 2 | SOT23 |
ST Microelectronics |
LOW VOLTAGE 4ohm SPDT SWITCH |
|
| 3 | SOT23 |
Zetex |
Thermal Resistance and Surface mounted |
|
| 4 | SOT23 |
Diodes |
SUGGESTED PAD LAYOUT |
|
| 5 | SOT23 |
STMicroelectronics |
OUTLINE AND MECHANICAL DATA |
|
| 6 | SOT23 |
TopLine |
JEDEC TO-236AB Package |
|
| 7 | SOT23-5 |
Zetex Semiconductors |
Surface mounted |
|
| 8 | SOT23-6 |
ZETEX |
Package information |
|
| 9 | SOT23-6 |
HOLTEK |
6-pin Package Information |
|
| 10 | SOT23-6L |
ST Microelectronics |
LOW VOLTAGE 4ohm SPDT SWITCH |
|
| 11 | SOT23ESD-A |
Cooper Electronic Technologies |
Surface Mount Transient Voltage Suppressors |
|
| 12 | SOT24LC |
WPM |
Low Capacitance Uni-direction TVS Diodes |
|