PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 SOT263 E P A A1 q D1 D mounting base L3 m L L2 L1 Q 1 e b 5 w M c 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.39 1.27 b 0.9 0.7 c 0.7 0.4 D 15.8 15.2 D1 6.4 5.9 E 10.3 9.
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SOT262A1 |
Philips |
Flanged double-ended ceramic package | |
2 | SOT23 |
TT Electronics |
Surface Mount Voltage Divider | |
3 | SOT23 |
ST Microelectronics |
LOW VOLTAGE 4ohm SPDT SWITCH | |
4 | SOT23 |
Zetex |
Thermal Resistance and Surface mounted | |
5 | SOT23 |
Diodes |
SUGGESTED PAD LAYOUT | |
6 | SOT23 |
STMicroelectronics |
OUTLINE AND MECHANICAL DATA | |
7 | SOT23 |
TopLine |
JEDEC TO-236AB Package | |
8 | SOT23-5 |
Zetex Semiconductors |
Surface mounted | |
9 | SOT23-6 |
ZETEX |
Package information | |
10 | SOT23-6 |
HOLTEK |
6-pin Package Information | |
11 | SOT23-6L |
ST Microelectronics |
LOW VOLTAGE 4ohm SPDT SWITCH | |
12 | SOT23ESD-A |
Cooper Electronic Technologies |
Surface Mount Transient Voltage Suppressors |