® Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.20 mm 10-40 µm molding compound 1.65 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 .
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SO1316 |
AUK |
Chip LED Lamp | |
2 | SO14L |
Willow Technologies |
SMT-Precision-R-Networks | |
3 | SO-502 |
VECTRON |
SAW Based Clock Oscillator | |
4 | SO-720 |
Vectron |
Standard Crystal Oscillators | |
5 | SO2222 |
ST Microelectronics |
SMALL SIGNAL NPN TRANSISTORS | |
6 | SO2222A |
ST Microelectronics |
SMALL SIGNAL NPN TRANSISTORS | |
7 | SO2336-G |
AUK |
High Brightness Chip LED | |
8 | SO2369 |
ST Microelectronics |
SMALL SIGNAL NPN TRANSISTORS | |
9 | SO2369A |
ST Microelectronics |
SMALL SIGNAL NPN TRANSISTORS | |
10 | SO2907 |
ST Microelectronics |
SMALL SIGNAL PNP TRANSISTORS | |
11 | SO2907A |
ST Microelectronics |
SMALL SIGNAL PNP TRANSISTORS | |
12 | SO3417 |
AUK |
LED Lamp |