.....1-30 I/O Signal Descriptions .1-30 Address MAP ........
...1-2 Microprocessor and Overall Architecture ..1-2 Memory Subsystem 1-2 General Peripherals1-3 Serial Communication.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | S3C24A0 |
Samsung semiconductor |
APPLICATION PROCESSOR FOR 2.5G/3G MOBILE PHONES | |
2 | S3C2400 |
Samsung semiconductor |
RISC MICROPROCESSOR | |
3 | S3C2410A |
Samsung semiconductor |
32-Bit RISC Microprocessor | |
4 | S3C2410X |
Samsung semiconductor |
32-Bit RISC Microprocessor | |
5 | S3C2412 |
Samsung |
32-BIT CMOS MICROCONTROLLER | |
6 | S3C2412X |
Samsung |
32-BIT CMOS MICROCONTROLLER | |
7 | S3C2413X |
Samsung |
32-BIT RISC MICROPROCESSOR | |
8 | S3C2416 |
Samsung Electronics |
(S3C24xx) RISC Microprocessor | |
9 | S3C2440 |
Samsung semiconductor |
32-BIT CMOS MICROCONTROLLER | |
10 | S3C2440A |
Samsung semiconductor |
32-BIT CMOS MICROCONTROLLER | |
11 | S3C2440X |
Samsung semiconductor |
16/32-bit RISC microprocessor | |
12 | S3C2450 |
Samsung Electronics |
(S3C24xx) RISC Microprocessor |