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.........7 1.1 289-Pins BGA Package Diagram .......7 1.1.1 289-Pins BGA Package Diagram for RT3050F ..............7 1.1.2 289-Pins BGA .
Embedded 2 T2R 2.4G CMOS RF Embedded 802.11n 2T2R MAC/BBP w/MLD Order Information Part Number Temp Range Package 0 RT3050F -10~55 C Green/ RoHS Compliant TFBGA 289 ball (14mmx14mm) 0 RT3052F -10~55 C Green/ RoHS Compliant TFBGA 289 ball (14mmx14mm) Ralink Technology, Corp. (Taiwan) 5th F. No. 36,Taiyuan St, Jhubei City, Hsin-Chu, Taiwan, R.O.C. Tel: 886-3-560-0868 Fax: 886-3-560-0818 Ralink Technology, Corp. (USA) 20833 Stevens Creek Blvd., Suite 200 Cupertino, CA95014 Tel: (408) 725-8070 Fax: (408)725-8069 http://www.ralinktech.com enhancement 300Mbps PHY data rate 1x1/1x2/2x2 modes.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | RT3050F |
Ralink |
high performance 384MHz MIPS24KEc CPU core |
|
| 2 | RT3052 |
Ralink Technology |
802.11n Wireless Single Chip AP/Router SoC |
|
| 3 | RT3052 |
Ralink |
high performance 384MHz MIPS24KEc CPU core |
|
| 4 | RT3052F |
Ralink |
high performance 384MHz MIPS24KEc CPU core |
|
| 5 | RT3000A |
Richtek |
3-Axis Digital Accelerometer |
|
| 6 | RT3000B |
Richtek |
3-Axis Digital Accelerometer |
|
| 7 | RT3000C |
Richtek |
3-Axis Digital Accelerometer |
|
| 8 | RT3070 |
Ralink |
Highly integrated MAC/BBP and 2.4 GHz RF single chip |
|
| 9 | RT314005 |
TE |
General Purpose Relays PCB Relays |
|
| 10 | RT314006 |
TE |
General Purpose Relays PCB Relays |
|
| 11 | RT314009 |
TE |
General Purpose Relays PCB Relays |
|
| 12 | RT314012 |
Siemens Semiconductor Group |
Miniature Printed Circuit Board Relays / Sockets and Accessories |
|