Correct typo information Update Update IO Ground information Updated section “Package Thermal Characteristics” Initial released Copyright 2020 © Fuzhou Rockchip Electronics Co., Ltd. -2- RK3328 Datasheet Rev 1.4 Table of Content Table of Content ............3 Figur.
.....7 1.3 Block Diagram .. 15 Chapter 2 Package Information...16 2.1 Order Information .... 16 2.2 Top Marking ..... 16 2.3 TFBGA395L Dimension .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | RK3326 |
Rockchip |
high-performance Quad-core application processor | |
2 | RK3326-S |
Rockchip |
high-performance Quad-core application processor | |
3 | RK33 |
Sanken electric |
Schottky Barrier Diodes | |
4 | RK33 |
EIC discrete Semiconductors |
SCHOTTKY BARRIER RECTIFIER DIODES | |
5 | RK3308 |
Rockchip |
high-performance Quad-core application processor | |
6 | RK3308B |
Rockchip |
high-performance Quad-core application processor | |
7 | RK3308H3 |
Rockchip |
high-performance Quad-core application processor | |
8 | RK3368 |
Rockchip |
high-performance processor | |
9 | RK3368H |
Rockchip |
high performance processor | |
10 | RK3399 |
Rockchip |
high-performance processor | |
11 | RK3399Pro |
Rockchip |
high-performance processor | |
12 | RK3026 |
Rockchip |
High Performance and Low-power Pocesor |