Base Model w/ leads Lapped Model Sealed Model Lapped and Sealed Model Features • • • • • • • • RoHS 2002/95/EC compliant Solid-state reliability. Built with high temperature solder with the ability to withstand higher assembly processing temperatures for short periods of time (<160°C). Superior nickel diffusion barriers on elements High strength for rugged .
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• RoHS 2002/95/EC compliant Solid-state reliability. Built with high temperature solder with the ability to withstand higher assembly processing temperatures for short periods of time (<160°C). Superior nickel diffusion barriers on elements High strength for rugged environment. Porched configuration for enhanced leadwire strength RTV sealing available (Optional) Lapped option available for multiple module applications. Doc # 102-0274 Rev A
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | RC12-2.5 |
ETC |
Thermoelectric Cooler | |
2 | RC12-6 |
ETC |
Thermoelectric Cooler | |
3 | RC12-8 |
ETC |
Thermoelectric Cooler | |
4 | RC12 |
Phycomp |
Precision chip resistors | |
5 | RC12 |
Stackpole |
Carbon Composition Resistor | |
6 | RC1202-A |
OKAYA |
LCD | |
7 | RC1206 |
Yageo |
HIGH POWER CHIP RESISTORS | |
8 | RC1206 |
Vishay |
Thick Film Chip Resistors | |
9 | RC1206 |
HITANO |
Thick Film Chip Resistor | |
10 | RC1206 |
TAITRON |
Thick Film Chip Resistor General Purpose | |
11 | RC1210 |
Yageo |
GENERAL PURPOSE CHIP RESISTORS | |
12 | RC1210 |
HITANO |
Thick Film Chip Resistor |