MZC16B5 - ES Components

MZC16B5 Small Signal Zener Diodes

ES Components MZCxxxAx and MZCxxxBx Family Bare Die DATA SHEET Small Signal Zener Diodes Wire Bondable, Epoxy Attach Bare Die Rev: B FEATURES • Wafer fab by Vishay Semiconductor • Silicon planar Zener diode MECHANICAL DATA Top Metal ( Anode ) Back Metal ( Cathode ) Passivation AlSi AuSb Nitride THERMAL CHARACTERISTICS Parameter: Junction Temperature .

Features

• Wafer fab by Vishay Semiconductor
• Silicon planar Zener diode MECHANICAL DATA Top Metal ( Anode ) Back Metal ( Cathode ) Passivation AlSi AuSb Nitride THERMAL CHARACTERISTICS Parameter: Junction Temperature (max) Operating Temperature Range Storage Temperature Range Symbol: TJ TOP TS Value: +175 -55 to +175 -55 to +175 Unit °C °C °C DEVICE CODE MZC Prefix MZC 6.8 Zener Voltage 2.4 to 75 (See Table) A Series A = High Level B = Low Level 5 Tolerance (%VZ) 2 5 10 E Bottom Side Attach Method Epoxy Die Attach B Top Side Connection Method Wire Bondable D Form D = Die 108 Pratts Ju.