The MX2300C uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. MX2300C s G General Features VDS =20V,ID =2.5A RDS(ON)(Typ.) 52mΩ @ Vgs=4.5V RDS(ON)(Typ.) 72mΩ @ Vgs=2.5V High power and current handing.
VDS =20V,ID =2.5A RDS(ON)(Typ.) 52mΩ @ Vgs=4.5V RDS(ON)(Typ.) 72mΩ @ Vgs=2.5V High power and current handing capability k Lead free product is acquired Surface mount package e Application T PWM applications Load switch rce Power management Schematic diagram 3 A2sHB 1 2 Marking and pin assignment ipSou SOT-23topview Ch Absolute Maximum Ratings (TA=25℃ unless otherwise noted) parameter symbol limit unit Drain-source voltage VDS 20 V Gate-source voltage VGS ±12 V Drain current-continuousa@Tj=125℃ -pulse db ID 2.5 A IDM 5 A Maximum power dissipation.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | MX2301A |
ChipSourceTek |
P-Channel Power MOSFET | |
2 | MX2302A |
ChipSourceTek |
N-Channel Power MOSFET | |
3 | MX2305 |
ChipSourceTek |
P-Channel Power MOSFET | |
4 | MX23C1010 |
Macronix International |
1M-BIT MASK ROM | |
5 | MX23C1024 |
Macronix International |
1M-BIT [64K x 16] CMOS MASK ROM | |
6 | MX23C1610 |
Macronix International |
5 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM | |
7 | MX23C1611 |
Macronix International |
5 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM | |
8 | MX23C2000 |
Macronix International |
2M-BIT MASK ROM (8 BIT OUTPUT) | |
9 | MX23C2100 |
Macronix International |
2M-BIT 256K x 8/128K x 16 CMOS MASK ROM | |
10 | MX23C3210 |
Macronix International |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | |
11 | MX23C3211 |
Macronix International |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM | |
12 | MX23C4000 |
Macronix International |
4M-BIT MASK ROM (8 BIT OUTPUT) |