MTE8087T - Marktech Corporate

MTE8087T Metal Can Infrared Emitter

www.DataSheet4U.com Metal Can Infrared Emitter MTE8087T Features Ultra High Power Output Chip Size 1.0x1.0mm Four Wire Bonds on Die Corners Standard 3−lead TO−39 Hermetic Package Two Catode Pins Must Be Externally Connected Together Maximum Ratings (Ta=25 C) Characteristic Forward Current Pulsed Forward Current Reverse Voltage Power Dissipation Operating .

Features

Ultra High Power Output Chip Size 1.0x1.0mm Four Wire Bonds on Die Corners Standard 3−lead TO−39 Hermetic Package Two Catode Pins Must Be Externally Connected Together Maximum Ratings (Ta=25 C) Characteristic Forward Current Pulsed Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Junction Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tj Tsol Max. 500 10.00 5 1000.00 −50 ~ +100 −50 ~ +100 100 260 Test Condition Unit − tw=10µ S, T=10mS − − − − − for 3 sec. max mA A V mW o o DataShee DataSheet4U.com o o C C C C o Opto−Electrical.