MPC8200 - Microsemi

MPC8200 PASSIVE DEVICES - MMSM Capacitors

KEY FEATURES  Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical  Surface Mount design  Broadband Performance through X-Band  Available on Tape & Reel for automated pick & place assembly  Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integrati.

Features

 Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical
 Surface Mount design
 Broadband Performance through X-Band
 Available on Tape & Reel for automated pick & place assembly
 Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functiona.