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MMBZ5221BTW~MMBZ5262BTW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die Construction • 200mW Power Dissipation • Zener Voltages from 2.4~51V • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: SOT-363, Plastic • Terminals: Solderable per.
• Planar Die Construction
• 200mW Power Dissipation
• Zener Voltages from 2.4~51V
• Ideally Suited for Automated Assembly Processes
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: SOT-363, Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.0002 ounces, 0.006 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ=25OC unless otherwise noted)
PARAMETER
Power Dissipation (Note A)
Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method) (Notes B)
Operating Junction Temperature and Storage Temperatu.
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