d Lead wire dia. P Tapingpitch P0 Sprocketholepitch P1 Centering of lead wire P2 Centering of the body p Lead spacing dS Component alignment H Height from Sproket Center to component body W Tape width W 0 Width of adhesive tape W 1 Sprocket hole alignment D0 Positionholediameter t Tape thickness DIMENSION TOLERANCES mm Inches mm Inches 0.5 to 0.6 0.020 to 0..
value and Voltage range
• Wide miniature size
• Ultra retardant case and potting
• Flame dimensions and surface finish due to molded case construction
• Consistent in tape & reel form for automatic insertion
• Available
• Self healing capability GENERAL SPECIFICATIONS: Dissipation factor: For capacitance ≤ 0.1 µF = 0.010 max at 1 KHz, 0.015 max at 10 KHz, 0.030 max at 100 KHz. For capacitance > 0.1 µF = 0.0010 max at 1 KHz, 0.0015 max at 10 KHz. Insulation resistance: For nominal voltage < 100 V DC; ≥10,000 M Ohms for C ≤ 0.10 µF, ≥1,000 seconds for C > 0.10 µF. For nominal voltage ≤ 100 V DC;.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | MKT075 |
Sharma Electro Components |
Film Capacitors | |
2 | MKT |
HITANO |
Metallized Polyester Film Capacitor | |
3 | MKT-68 |
Konek |
Capacitors | |
4 | MKT-D14D |
National Semiconductor |
SIDEBRAZED CERAMIC 14 LEAD | |
5 | MKT-D20A |
National Semiconductor |
MKT-D20A | |
6 | MKT-D48A |
ETC |
MKT-D48A | |
7 | MKT-MSA28 |
National |
MOLDED SSOP | |
8 | MKT-MSC16 |
National |
MOLDED PACKAGE SSOP / EIAJ | |
9 | MKT-N24A |
National Semiconductor |
MKT-N24A | |
10 | MKT100 |
Sharma Electro Components |
Film Capacitors | |
11 | MKT1813 |
Vishay |
DC Film Capacitors | |
12 | MKT1817 |
Vishay |
Metallized Polyester Film Capacitors |