MC33662 - Freescale Semiconductor

MC33662 LIN Physical Layer

Freescale Semiconductor Advance Information Document Number: MC33662 Rev. 7.0, 1/2014 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enabl.

Features

of CAN are not required. The three 33662 versions are designed to operate at different maximum baud rates. The 33662LEF and 33662BLEF, and the 33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They integrate a fast baud rate (above 100 kbps), as reported by the RXD pin for test and programming modes. They provide excellent EMC (Electromagnetic Compatibility) and Radiated Emission performance, ESD (Electrostatic Discharge) robustness, and safe behavior, in the event of a LIN bus shor.