MADP-042305-13060 - MA-COM

MADP-042305-13060 PIN Diodes

This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically cond.

Features

 Surface Mount
 No Wirebonds Required
 Rugged Silicon-Glass Construction
 Silicon Nitride Passivation
 Polymer Scratch Protection
 Low Parasitic Capacitance and Inductance
 High Average and Peak Power Handling
 RoHS Compliant Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls el.