of Intel’s thermal impedance test methodology. ~“52’80320NL’ L{ ~ 40 39 38 37 36 35 34 33 Vcc P’,’ ADO PO.1 AD1 PO.2 A02 PO.3 A03 PO.4 AD4 PO.5 AD5 P06 AD’ 3 PO.7A07 3 EIJvpp” Z ALEIPROG” 3%FFI 3 P2.7 A15 2 P2.6A14 3 P2.5 A13 I P2.4 A12 1 P2.3 Al 1 > P2.2 AlO 3 P2 1 A9 X P20 A8 T2 T2EX ‘1 ‘ss+!-29 26 27 26 25 24 23 22 21 EPROM only q “*Do not connect P.
of the MCS 51 Family, as listed below: Port Pin P3,0 P3.1 P3.2 P3,3 P3.4 P3.5 P3.6 P3.7 Alternative Function RXD (serial input port) TXD (serial output port) INTO(external interrupt O) INT1 (external interrupt 1) TO(Timer Oexternal input) T1 (Timer 1 external input) WR (external data memory write strobe) ~ (external data memory read strobe) I Port Pin P1.0 P1.1 I Alternative Function T2 (Timer/Counter 2 External Input) T2EX (Timer/Counter 2 Capture/Reload Trigger) I RST: Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device, ALE/PROG: Ad.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | LP8031AH |
Intel |
MCS51 8-BIT CONTROL-ORIENTED MICROCONTROLLERS | |
2 | LP801 |
Polyfet RF Devices |
SILICON GATE ENHANCEMENT MODE RF POWER LDMOS TRANSISTOR | |
3 | LP801 |
Polyfet RF Devices |
SILICON GATE ENHANCEMENT MODE RF POWER LDMOS TRANSISTOR | |
4 | LP801B |
Shenzhen |
Encoder/Decoder | |
5 | LP802 |
Polyfet RF Devices |
SILICON GATE ENHANCEMENT MODE RF POWER LDMOS TRANSISTOR | |
6 | LP802 |
Polyfet RF Devices |
SILICON GATE ENHANCEMENT MODE RF POWER LDMOS TRANSISTOR | |
7 | LP8029-L4 |
Silvan Chip |
built-in decoder RF amplification | |
8 | LP8029-M4 |
Silvan Chip |
built-in decoder RF amplification | |
9 | LP802B |
LAND-HOP |
Tri-state decoding controller | |
10 | LP8051AH |
Intel |
MCS51 8-BIT CONTROL-ORIENTED MICROCONTROLLERS | |
11 | LP8051AH |
Intel |
MCS51 8-BIT CONTROL-ORIENTED MICROCONTROLLERS | |
12 | LP8052AH |
Intel |
MCS51 8-BIT CONTROL-ORIENTED MICROCONTROLLERS |