The ISPD6_ series of optically coupled isolators consist of an infrared light emitting diode and NPN silicon photodarlington in a standard 6pin dual in line plastic package with the base pin unconnected. 1.4 0.9 0.48 0.25 FEATURES l Options :10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no. .
l Options :10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no. l High Current Transfer Ratio (500% min) l High Isolation Voltage (5.3kVRMS ,7.5kVPK ) l Basepin unconnected for improved noise immunity in high EMI environment l High sensitivity to low input drive current l Custom electrical selections available ABSOLUTE MAXIMUM RATINGS (25°C unless otherwise specified) Storage Temperature -55°C to + 150°C Operating Temperature -55°C to + 100°C Lead Soldering Temperature (1/16 inch (1.6mm) from case for 10 secs) 260°C INPUT DIODE For.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | ISPD60 |
ETC |
(ISPD6x) NON BASE LEAD OPTICALLY COUPLED ISOLATOR PHOTODARLINGTON OUTPUT | |
2 | ISPD61 |
ETC |
(ISPD6x) NON BASE LEAD OPTICALLY COUPLED ISOLATOR PHOTODARLINGTON OUTPUT | |
3 | ISPD63 |
ETC |
(ISPD6x) NON BASE LEAD OPTICALLY COUPLED ISOLATOR PHOTODARLINGTON OUTPUT | |
4 | ISPD64 |
ETC |
(ISPD6x) NON BASE LEAD OPTICALLY COUPLED ISOLATOR PHOTODARLINGTON OUTPUT | |
5 | ISPD65 |
ETC |
(ISPD6x) NON BASE LEAD OPTICALLY COUPLED ISOLATOR PHOTODARLINGTON OUTPUT | |
6 | ISP0912 |
Insight SiP |
Bluetooth Low Energy Module | |
7 | ISP091201 |
Insight SiP |
Bluetooth Low Energy Module | |
8 | ISP1016E |
Lattice Semiconductor |
High-Density Programmable Logic | |
9 | ISP1032E |
Lattice Semiconductor |
High-Density Programmable Logic | |
10 | ISP1032E |
Lattice Semiconductor |
High-Density Programmable Logic | |
11 | ISP1040B |
QLogic Corporation |
Intelligent SCSI Processor | |
12 | ISP1040B |
Qlogic |
SCSI I/O Processor |