Preliminary Data Sheet ISP3010 Built-in Antennas Ultra-Wide Band and Bluetooth Low Energy Smart Module This highly miniaturized LGA module, 14 x 14 x 1.5 mm, is based on the DW1000 UWB transceiver and nRF52832 BLE chip. Using a simple user interface via the SPI connection and integrating a Cortex™ M4 CPU, flash and RAM memory combined with optimized antenn.
IEEE802.15.4-2011 UWB compliant Single Mode BLE 5 Ready NFC-A Tag for OOB pairing Spatial resolution better than 10 cm Fully integrated UWB & BLE matching and Antennas Integrated UWB 38.4 MHz and BLE 32 MHz & 32.768 kHz Clocks DC/DC converters UWB section based on DecaWave DW1000 BLE section based on Nordic Semi nRF52 Externally Controlled or using embedded 32-bit.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | ISP321-1 |
ISOCOM COMPONENTS |
(ISP321-xx) HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
2 | ISP321-1-88XSM |
ETC |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
3 | ISP321-1X |
ISOCOM COMPONENTS |
(ISP321-xx) HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
4 | ISP321-2 |
ISOCOM COMPONENTS |
(ISP321-xx) HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
5 | ISP321-2X |
ISOCOM COMPONENTS |
(ISP321-xx) HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
6 | ISP321-4 |
ISOCOM COMPONENTS |
(ISP321-xx) HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
7 | ISP321-4X |
ISOCOM COMPONENTS |
(ISP321-xx) HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS | |
8 | ISP3582 |
NXP Semiconductors |
Certifed Wireless USB from the USB-IF | |
9 | ISP0912 |
Insight SiP |
Bluetooth Low Energy Module | |
10 | ISP091201 |
Insight SiP |
Bluetooth Low Energy Module | |
11 | ISP1016E |
Lattice Semiconductor |
High-Density Programmable Logic | |
12 | ISP1032E |
Lattice Semiconductor |
High-Density Programmable Logic |