International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the sil.
• Ultra Low VF To Footprint Area
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Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel
Applications
• Reverse Polarity Protection
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• Current Steering Freewheeling Flyback Oring FlipKYTM
Major Ratings and Characteristics Characteristics
IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 µs sine VF TJ @ 0.5 Apk, TJ=125°C range
IR0530CSP
0.5 30 190 0.33 - 55 to 150
Units
A V A V °C
Description
International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in in.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | IR0530CSPTRPBF |
International Rectifier |
FlipKY | |
2 | IR05H40CSPTR |
International Rectifier |
FlipKY | |
3 | IR01D214 |
International Rectifier |
(IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE | |
4 | IR01D224 |
International Rectifier |
(IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE | |
5 | IR01D420 |
International Rectifier |
(IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE | |
6 | IR01H214 |
International Rectifier |
(IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE | |
7 | IR01H224 |
International Rectifier |
(IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE | |
8 | IR01H420 |
International Rectifier |
(IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE | |
9 | IR02H420 |
International Rectifier |
HIGH VOLTAGE HALF-BRIDGE | |
10 | IR03H420 |
International Rectifier |
HIGH VOLTAGE HALF-BRIDGE | |
11 | IR062HD4C10U-P2 |
International Rectifier |
HIGH VOLTAGE HALF BRIDGE | |
12 | IR082HD4C10U-P2 |
International Rectifier |
HIGH VOLTAGE HALF BRIDGE |