HCB1608KF-800T30 - TAI-TECH ADVANCED ELECTRONICS

HCB1608KF-800T30 FERRITE CHIP BEADS

BODY TERMINATION SPECIFICATION FERRITE Ag / Ni / Sn REMARK 4. GENERAL SPECIFICATION : a. TEMP. RISE : 30° C MAX. b. RATED CURRENT : BASE ON TEMP. RISE c. STORAGE TEMP. : -55° C ----+125° C d. OPERATING TEMP. : -55° C----+125° C e. RESISTANCE TO SOLDER HEAT : 260° C.10 SECS. TAI-TECH ADVANCED ELECTRONICS (S) PTE LTD H www.DataSheet4U.com SPECIFICATION FO.

Features

1608KF-121T20 HCB1608KF-151T20 HCB1608KF-221T20 HCB1608KF-301T10 HCB1608KF-471T10 HCB1608KF-601T10 EIA Size 0603 0603 0603 0603 0603 0603 0603 0603 Impedance (ȍ) 30 ± 25% 80 ± 25% 120 ± 25% 150 ± 25% 220 ± 25% 300 ± 25% 470 ± 25% 600 ± 25% Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 DC Resistance (ȍ) MAX. 0.04 0.04 0.10 0.10 0.10 0.20 0.20 0.20 Rated Current ( mA ) MAX. 3000 3000 2000 2000 2000 1000 1000 1000 6. IMPEDANCE Vs FREQUENCY CURVE : 120 HCB1608KF-300T30 HCB1608K-300T30F HC B1 608K-300T30 160 HCB1608KF-800T30 HCB1608K-800T30F H CB1608 K-800T30 IM PED ANC E(Ohm ) .