HC55171B Data Sheet July 1998 File Number 4422.1 Low Cost 5 REN Ringing SLIC for ISDN Modem/TA and WL The HC55171B low cost, 5 REN ringing SLIC is designed to accommodate a wide variety of short loop applications and provides the same degree of flexibility as the high performance HC55171. The flexible features include open circuit tip to ring DC voltages, use.
include open circuit tip to ring DC voltages, user defined ringing waveforms, ring trip detection thresholds, and loop current limits that can be tailored for many applications. Additional features of the HC55171B are complex impedance matching, pulse metering, and transhybrid balance. The HC55171B is designed for use in short loop, low cost systems where traditional ring generation is not economically feasible. The device is manufactured in a high voltage Dielectric Isolation (DI) process. The DI process provides substrate latch up immunity, resulting in a robust system design. A thermal shutd.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | HC55171 |
Intersil Corporation |
5 REN Ringing SLIC | |
2 | HC5517 |
Intersil Corporation |
3 REN Ringing SLIC | |
3 | HC5517B |
Intersil Corporation |
Low Cost 3 REN Ringing SLIC | |
4 | HC55120 |
Intersil |
Low Power UniSLIC14 | |
5 | HC55121 |
Intersil |
Low Power UniSLIC14 | |
6 | HC5513 |
Intersil Corporation |
TR909 DLC/FLC SLIC | |
7 | HC55130 |
Intersil |
Low Power UniSLIC14 | |
8 | HC55131 |
Intersil |
Low Power UniSLIC14 | |
9 | HC55140 |
Intersil |
Low Power UniSLIC14 | |
10 | HC55141 |
Intersil |
Low Power UniSLIC14 | |
11 | HC55142 |
Intersil |
Low Power UniSLIC14 | |
12 | HC55143 |
Intersil |
Low Power UniSLIC14 |