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GL390V - Sharp Electrionic Components

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GL390V Thin Bow Type Resin Mold Package Infrared Emitting Diodes

GL390/GL390V GL390/GL390V s Features 1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage ( GL390V) VFM : TYP. 1.9V at IFM=0.5A Thin Bow Type Resin Mold Package Infrared Emitting Diodes s Outline Dimensions (Unit : mm) φ 3.8 ± 0.3 φ 3.1 g1 Epoxy resin 0.1 2.0 + - 0.3 1 s Applications 1. Cameras 2. Infrare.

Features

1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage ( GL390V) VFM : TYP. 1.9V at IFM=0.5A Thin Bow Type Resin Mold Package Infrared Emitting Diodes s Outline Dimensions (Unit : mm) φ 3.8 ± 0.3 φ 3.1 g1 Epoxy resin 0.1 2.0 + - 0.3 1 s Applications 1. Cameras 2. Infrared remote controllers Protruded resin 0.5 0.2 + - 0.2 5.2 ± 0.3 4.1 0.8 MAX. 2 24.0 MIN. 1 Anode 2 Cathode 2 - 0.5 ± 0.1 (1.0) 1 2 2 - 0.5 ± 0.1 (2.54) g 1 Resin type GL390
* Tolerance : ± 0.2mm Pale blue transparent resin Blue transparent resin GL390V s Model Lineup.

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