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SPECIFICATION OF FBM□-10 SERIES APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is particular effective with unstable grounding. 3. High frequency EMI prevention of computers , printers , VCRs , TVs and portable telephone. 4. The FBM□-10 series can minimize attenuation of the signal wave form .
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FBM-11-201209-121A50T - OMPON
SPECIFICATION OF FBM□-_ _ _ _A□□ SERIES APPLICATIONS 1. EMI suppression for various electric equipment by the addition o.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | FBM-11-201209-121A30T |
OMPON |
EMI suppression |
|
| 2 | FBM-11-201209-121A40T |
ETC |
Multilayer Chip Beads |
|
| 3 | FBM-11-201209-121A40T |
OMPON |
EMI suppression |
|
| 4 | FBM-11-201209-121T |
ETC |
Multilayer Chip Beads |
|
| 5 | FBM-11-201209-100A10T |
OMPON |
EMI suppression |
|
| 6 | FBM-11-201209-100A60T |
ETC |
Multilayer Chip Beads |
|
| 7 | FBM-11-201209-100A60T |
OMPON |
EMI suppression |
|
| 8 | FBM-11-201209-101A30T |
OMPON |
EMI suppression |
|
| 9 | FBM-11-201209-102A10T |
OMPON |
EMI suppression |
|
| 10 | FBM-11-201209-102T |
ETC |
Multilayer Chip Beads |
|
| 11 | FBM-11-201209-151A40T |
OMPON |
EMI suppression |
|
| 12 | FBM-11-201209-170T |
ETC |
Multilayer Chip Beads |
|