SPECIFICATION OF FBM□-10 SERIES APPLICATIONS 1. EMI suppression for various electric equipment by the addition of impedance to the circuit. 2. It is particular effective with unstable grounding. 3. High frequency EMI prevention of computers , printers , VCRs , TVs and portable telephone. 4. The FBM□-10 series can minimize attenuation of the signal wave form .
8) 1.20±0.20 (0.047±0.008) 1.60±0.20 (0.063±0.008) C 0.50±0.10 (0.020±0.004) 0.80±0.20 (0.031±0.008) 0.90±0.20 (0.035±0.008) 1.10±0.20 (0.043±0.008) UNIT:m/m (inch) D 0.25±0.10 (0.010±0.004) 0.30±0.20 (0.012±0.008) 0.50±0.30 (0.020±0.012) 0.50±0.30 (0.020±0.012) ※All the date listed in this catalogue are for reference only, King Core reserves the right to alter or revise the specifications without prior notification. KING CORE ELECTRONICS INC. Tel:886-3-4698855 Fax:886-3-4691395 No.269,Nanfong Rd.,Pingjhen City,Taoyuan County, Taiwan E-mail:[email protected] Web Site:http://www.kingc.
MULTILAYER CHIP BEADS FBM-SERIES APPLICATIONS 1. EMI suppression for various electric equipment by the addition of imp.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | FBM-10-160808-102T |
ETC |
Multilayer Chip Beads | |
2 | FBM-10-160808-121T |
ETC |
Multilayer Chip Beads | |
3 | FBM-10-160808-152T |
ETC |
Multilayer Chip Beads | |
4 | FBM-10-160808-300T |
ETC |
Multilayer Chip Beads | |
5 | FBM-10-160808-301T |
ETC |
Multilayer Chip Beads | |
6 | FBM-10-160808-601T |
ETC |
Multilayer Chip Beads | |
7 | FBM-10-160808-750T |
ETC |
Multilayer Chip Beads | |
8 | FBM-10-160808-800T |
ETC |
Multilayer Chip Beads | |
9 | FBM-10-100505-121T |
ETC |
Multilayer Chip Beads | |
10 | FBM-10-100505-151T |
ETC |
Multilayer Chip Beads | |
11 | FBM-10-100505-201T |
ETC |
Multilayer Chip Beads | |
12 | FBM-10-100505-221T |
ETC |
Multilayer Chip Beads |